AGC Asia Pacific

AGC Asia Pacific

AGC provides materials and equipment components used across a wide range of semiconductor manufacturing processes. At this exhibition, we will showcase glass carriers for advanced packaging, glass substrates with microvias for glass core applications, films used in semiconductor manufacturing processes and production equipment, resin products, and more.

In addition, we will introduce our fluorochemical recycling initiatives aimed at contributing to an environmentally friendly, sustainable circular society.

PV-Building-Integrated Solutions, PV: Modules, Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners, Wire Bonding Equipment, Modules, Thin Film, Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment, Cleaning; Washing; Drying Equipment for Substrate; Fab Processing, Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD, Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment, Etching; Stripping; Ashing - Dry and Wet Equipment, Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment, Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive, Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools, Package Substrates; Laminate; Film based, Packages; Ceramic and Other High Temp compounds, Acids; Etchants, Cleaning Chemicals; Solvents; Strippers, Other Specialty Chemicals, Gases Materials, CMP; Grind; Lap; Polish; Abrasive materials, Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures, Substrate Materials, Gaskets; Seals; O rings; Elastomers; Resins, Sensors