Name
Boschman Advanced Packaging Technology
What We Do
Boschman is a high-tech, engineering driven Dutch company focusing on advanced back-end semiconductor packaging solutions. Our technology enables revolutionary solutions. For over 30 years we specialized in the development and supply of advanced transfer molding and more recently sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages. We have an extensive install base of molding systems and already since 2014 have been and remain the market leader for Ag sintering solutions. We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging production concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding or sintering processes, the lowest cost of ownership, and the shortest time to market.
Boschman technologies:
• Ag-Sintering Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.
• Film Assisted Molding (FAM) Film Assisted Molding is a cluster of unique technologies using films in between the molds and the products to be encapsulated. This technology offers many advantages.
• Dynamic Insert Technology (DIT) is a patented technology that has been developed to further optimize the performance of FAM to automatically and dynamically control pressure on one or multiple surfaces. To keep specific areas fully exposed.
• Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer molding) package encapsulation.
We are focused on well-defined high growth market segments incl. Power Electronics (Automotive, Smart Grid and Industrial), E-motors, Modules, MEMS, and Sensors.
Boschman technologies:
• Ag-Sintering Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.
• Film Assisted Molding (FAM) Film Assisted Molding is a cluster of unique technologies using films in between the molds and the products to be encapsulated. This technology offers many advantages.
• Dynamic Insert Technology (DIT) is a patented technology that has been developed to further optimize the performance of FAM to automatically and dynamically control pressure on one or multiple surfaces. To keep specific areas fully exposed.
• Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer molding) package encapsulation.
We are focused on well-defined high growth market segments incl. Power Electronics (Automotive, Smart Grid and Industrial), E-motors, Modules, MEMS, and Sensors.
Website
Categories (50)
Deflashing; Degating Tools, Die Bonding; Attach Equipment, Molding; Encapsulation; Decapsulation Equipment
Phone
65-968-624-13
Address
21 SERANGOON NORTH AVENUE 5, #02-01
Singapore, 554864
Singapore
Singapore, 554864
Singapore