Crest Systems (M) Sdn Bhd

Crest Systems (M) Sdn Bhd

Excellent Customer Relationship Crest relentless pursuit in providing state of the art instruments and peace of mind after sales support has shaped the company commitment for investment in training, spare parts inventory and strong support structure thereby achieving excellent relationship with customers and principals. Global Partners Together with our global key partners, Crest strive to provide our customers market leading technological solutions in enabling important discoveries, enhancing imaging and analytical capabilities as well as helping to achieve higher productivity.

Package Simulation; Characterization Equipment, Solder Reflow; Soldering & Brazing Equipment, Wire Bonding Equipment, Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi, CV (capacitance-to-voltage) Probe Systems, Defect; Particle; Bump; Contamination Detection, Review or Inspection, Die Inspection; Die Shear, Film Thickness; Thickness; Uniformity Measurement; Ellipsometer, Flat; Notch Finding System, Instruments; Bench Top Test, Line Width; Critical Dimension (CD) Measurement, Microscopes: Atomic Force Microscopes (AFM), Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes, Microscopes: Optical Microscopes, Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr, Overlay Measurement, Package Inspection; Lead Scanners, Particle Monitors; Analyzers - Airborne or Liquid, Plate Inspection Equipment, Resistivity Measurement; 4 point probe; Sheet resistance, Spectrometers; Fourier Transform Infrared(FTIR); Attenuated Total Reflectance FTIR(ATR-FTIR); Auger , Stress; Refractive Index; Reflectivity & Conductivity Measurement, Thermal Sensing; Measurement; Analysis, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Weight Measurement; Precision Scales, Wire Bonding Inspection; Test, X-ray; XRF; 3-D X-Ray; Lexes Systems, Deep RIE etching; Dry etching, Double sided mask aligner, Equipment, Nanotechnology, Inspection and Metrology, Etching; Stripping; Ashing - Dry and Wet Equipment, Ion; E Beam Milling Etching Equipment, Transfer Systems for Wafer; Reticles or FPD's, Failure Analysis Systems, Probing Equipment (incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers), Lamps (non Lithography), all type UV; LED and other, Sensors, Cameras - Still; CCD; Video & Monitors, Exposure; Illumination Sources - Laser; Lamp; X-ray & other, Process Monitoring Systems, Wafer Handling