Disco Hi-Tec (Singapore) Pte Ltd.

Disco Hi-Tec (Singapore) Pte Ltd.

Originally a small producer of abrasives founded in 1937, DISCO has transformed itself into a leading manufacturer of precision machinery and diamond products. Disco’s mission is to advance “Kiru” (Cutting), “Kezuru” (Grinding) and “Migaku” (Polishing) technologies and support the development of leading edge science to benefit everyday life. We provide the following solutions for your dicing and grinding needs: 1. Thin wafer grinding - DBG System 2. Fully Automatic Grinder/Polisher DGP8761 & DFM2800 for the processing of ultra thin wafer together with the newly developed pad for stress relief polishing to realize higher productivity. 3. High speed & throughput, state of the art dicing saw - Fully Auto Dicing Saw, DFD6000 Series. 4. Stress Relief Solution for Smartcard, Stacked Die and Thin wafers -Fully Auto Surface Polisher, 8000 Series. 5. Laser grooving solution for Low-K devices and Die Attached film (DAF) - Fully Auto Laser Saw, DFL7000 series, for both laser grooving and stealth dicing. 6. High torque, hard material dicing capability - Auto Dicing Saw, Model DAD3351. 7. Other dicing saws to meet vast application needs - (300/3000 Series). 8. Disco Precision Diamond Blades, Grinding Wheels and Polishing Pad. 9. Supporting equipment and consumables for Dicing and Grinding solutions.

Backgrind; Slicing; Lapping; Polishing Equipment, Cleaning; Washing Equipment for Assembly & Packaging, Dicing; Sawing; Scribing; Separation Equipment, Cutting; Drilling; Laser ablation; Beveling Equipment, Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment, Cleaning; Washing; Drying Equipment for Substrate; Fab Processing, CMP; Grind; Lap; Polish; Abrasive materials