Name
EV Group
What We Do
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With application labs and cleanrooms in Europe, North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base.
Founded in 1980, the company is headquartered in Austria, with fully-owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore. The company employs more than 1700 people worldwide.
EVG’s products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With application labs and cleanrooms in Europe, North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base.
Founded in 1980, the company is headquartered in Austria, with fully-owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore. The company employs more than 1700 people worldwide.
Website
Categories (50)
Micro Electro Mechanical Systems (MEMS); Micro Machines, PV: Cells, Cleaning; Washing Equipment for Assembly & Packaging, Device Handling; Feeding Systems, Dispensing Systems, Hot Embossing System, Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners, Marking; Imprinting; Labeling Equipment, Wafer Level Bonders, Space simulation; Vacuum chambers, Defect; Particle; Bump; Contamination Detection, Review or Inspection, Film Thickness; Thickness; Uniformity Measurement; Ellipsometer, Line Width; Critical Dimension (CD) Measurement, Overlay Measurement, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Double sided mask aligner, Wafer Level Bonders, Equipment, Nanotechnology, Thin Film, Wafers, Bumping Systems, Cleaning; Washing; Drying Equipment for Substrate; Fab Processing, Coat; Develop; Resist Processing; Track Equipment, Lithography; Exposure - Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint, SOI Bonders; Temporary Bonders; De-Bonders, Spin on Glass (SOG); on Dielectric (SOD) Track systems, Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment, Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools, Package Substrates; Laminate; Film based, Thick Film Pastes; Materials, Thin Film; Dielectric Film Materials, Photo Resist; Developers & Ancillaries (incl. Adhesion promoter(HMDS); Primer; Anti-Reflective Coati, Spin on glass material, Surface protection material; coatings, Materials, Nanotechnology, Ingots, Wafers, Solar Glass, encapsulation, Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures, Chucks for Wafer and other Substrates, Pumps, Vacuum, Equipment Interface; Communication Protocols, Measurement; Inspection, Wafer Bumping Service, Equipment; Hardware; Product Design; Integration and Manufacturing, Manufacturing Process Support and Development, Product Development; Software Design; Product Lifecycle Management, Software Programming; Software Development, Wafer Handling
Phone
43-771-253-110
Address
DI Erich Thallner Straße 1
St. Florian am Inn, 4782
Austria
St. Florian am Inn, 4782
Austria